Kandou AI Raises $225M Oversubscribed Series A for AI Interconnects

Kandou AI, a Swiss fabless semiconductor company founded in 2011 and recently rebranded from Kandou Bus, secured $225 million in an oversubscribed Series A funding round. The investment, announced around March 24, 2026, was led by Maverick Silicon and included strategic participation from SoftBank Group Corp., Synopsys Inc., Cadence Design Systems Inc., and Alchip Technologies Limited, alongside existing investors. This round brings the company's total funding past $388 million and establishes a post-money valuation of $400 million. The capital targets manufacturing ramp-up of high-performance connectivity chips, partnership expansion with hyperscale customers, and development of next-generation IP exceeding 448G multi-terabit connectivity.