Xiaomi

AI Hardware · Semiconductors · Consumer Electronics

Launch

Xiaomi unveils AI Cube, a triple-chip mini PC for offline 120B AI models

Fusing three homegrown chips lets Xiaomi chase Nvidia and Apple's local-AI hardware lead without relying on external silicon suppliers.

• Xiaomi unveiled the AI Cube, an engineering prototype mini PC that fuses three in-house XRING chips to run large language models up to 120 billion parameters entirely offline.
• The system's main processor, the XRING O3, is Xiaomi's new flagship mobile SoC also set to debut in the Xiaomi 18 Fold, showing the company reusing smartphone silicon for desktop AI.
• A 6nm XRING O100 accelerator uses 3D wafer-stacked memory with 28,672 data connections to hit 1.22TB/s of bandwidth, while the automotive-grade XRING D100 adds up to 160GB of unified memory.
• The prototype sustains 150W of continuous power inside an aerospace-aluminum chassis with over 33,000 CNC-cut vents, but Xiaomi has set no price or release date for a retail version.
• The O100 and D100 chips aren't slated for commercial mass production until 2027, underscoring that AI Cube is a technology showcase rather than an imminent product launch.
• AI Cube shows Xiaomi extending its custom-silicon strategy from phones into local AI compute, joining Apple, Nvidia and AMD in a fast-growing market for private, offline LLM hardware.