Mueon Corporation

Semiconductors · Data Center Infrastructure · AI Hardware

Funding

Mueon raises $65M Series A to build 3D-stacked data center modules

Thermal management becomes the hard problem once chips are stacked instead of spread across a motherboard.

• Mueon Corporation raised $65 million in a Series A led by Maverick Silicon, with Intel Capital, Oregon Venture Fund, Wellington Capital, IQT and others joining.
• Founded in 2025 by former Intel engineers Wilfred Gomes (CEO, who worked on die-stacking) and Jack Hwang (CTO, who helped develop Intel's transistor-etching techniques), Mueon builds a 3D compute-and-memory platform called Cubelets.
• Cubelets stack compute and memory vertically along with the interconnect, power-delivery and thermal hardware needed to run them, aiming to cut the physical distance data travels between chips.
• Mueon claims the stacked architecture could be up to 10 times more power- and cost-efficient than conventional 2D server hardware.
• The round follows a $15.5 million seed raised in 2025 when Mueon emerged from stealth, bringing total funding to more than $80 million as it moves Cubelets from development to production readiness.
• As AI data centers hit power and space limits at the rack level, 3D-stacked compute tackles the core physical bottleneck of moving data between chips, a constraint increasingly shaping AI infrastructure economics.